1 The EIC Accelerator Project
EIC Accelerator Program Overview
The European Innovation Council (EIC) Accelerator program is a pivotal component of the European Union's strategy to foster innovation and support deep-tech startups. It aims to identify and scale breakthrough technologies, especially those with a significant impact on the economy and society. The EIC Accelerator provides a unique blend of funding options, combining grants and equity investments, to support companies in their growth journey.
Funding Structure
The EIC Accelerator offers substantial financial support, structured as blended finance. This includes:
Purpose in the DeepTech Ecosystem
The EIC Accelerator plays a crucial role in the European DeepTech and startup ecosystem by providing the necessary financial resources and support networks. It aims to bridge the funding gap often faced by innovative startups, which struggle to attract private investment during the early stages of development. By offering grants and equity, the program encourages private investors to engage with these companies, often leading to increased confidence in the viability of deep-tech innovations.
Scaling and Funding Support
The EIC Accelerator not only provides financial backing but also offers strategic support to help companies navigate the complexities of scaling their operations. This includes access to mentoring, networking opportunities, and expert advice, which are essential for startups aiming to transition from prototypes to market-ready products. The program seeks to leverage its resources to enhance synergies between startups and established industry players, thus facilitating partnerships that can lead to commercial success.
Case Study: FononTech Holding B.V.
Project Overview: Impulse Printing
FononTech Holding B.V. is a notable winner of the EIC Accelerator, recognized for their innovative project named Impulse Printing. This initiative focuses on developing the first-ever mask-based technology designed for the faster, precise, and sustainable printing of 3D interconnects, specifically targeting the display and semiconductor packaging industries.
Technology Background
Impulse Printing leverages advanced materials and printing techniques to revolutionize how interconnects are manufactured. Traditional methods of producing interconnects often involve lengthy and resource-intensive processes, leading to inefficiencies and higher production costs. FononTech’s technology aims to address these challenges by utilizing a mask-based approach that combines speed and precision.
The core of the Impulse Printing technology revolves around a unique printing process that allows for the deposition of conductive materials in a highly controlled manner. This is achieved through a series of innovative steps that include:
- Mask Design: The creation of precise masks that define the areas for material deposition.
- Material Selection: Utilizing advanced conductive materials that enhance the performance and sustainability of the printed interconnects.
- Automation and Speed: Incorporating automation into the printing process, allowing for rapid production cycles while maintaining high levels of accuracy.
The implications of this technology are significant. By improving the speed and precision of interconnect manufacturing, FononTech not only enhances the performance of electronic devices but also contributes to reducing waste and lowering the environmental impact associated with traditional manufacturing practices.
Strategic Importance
The successful implementation of Impulse Printing has the potential to disrupt the market by providing a more efficient and environmentally friendly solution for the semiconductor and display industries. Through the EIC Accelerator funding, FononTech aims to scale its operations, enhance its technological capabilities, and establish a strong foothold in a rapidly evolving sector.
In summary, the EIC Accelerator serves as a vital instrument for innovative companies like FononTech, enabling them to push boundaries in technology and drive economic growth within the European landscape.
2 The Funding Rounds
FononTech Holding B.V.: Financing and Funding Overview Since EIC Accelerator Win
Financing Raised
FononTech Holding B.V., based in Eindhoven, Netherlands, has raised significant early-stage funding as part of its scale-up journey. The most notable publicized financing event is a seed round in July 2023, where the company secured €2.3 million (approximately $2.53 million) to further develop its micro-electronics manufacturing technology.
Funding Rounds: Timing and Amounts
- Seed Round
- Date: July 2023
- Amount: €2.3 million
- Type: Convertible loan facility (plus a bank loan)
- This seed round represents FononTech’s first major publicly disclosed fundraising event since its founding and prior to or around the time of its EIC Accelerator success.
Investor Information
The investors participating in this seed round included: - TTT Smart Industries Fund
- SHIFT Invest
- Brabantse Ontwikkelingsmaatschappij (BOM)
- Brabant Startup Fonds (BSF)
- Sake Bosch (noted Dutch investor)
In addition to these equity/convertible note investors, Rabobank provided a separate loan facility as part of the same financing period.
Use of Funds & Strategic Positioning
The capital raised was earmarked for: - Further development of FononTech’s impulse printing technology for microelectronics.
Company Valuations
No public information is available regarding FononTech’s post-money valuation following this or any subsequent funding rounds.
Exit Events: IPOs, Acquisitions, Buyouts
As of May 2025:
Summary Table: FononTech Key Funding Details
| Date | Round Type | Amount Raised | Investors | Other Financiers | Valuation Info |
|---|---|---|---|---|---|
| Jul 2023 | Seed | €2.3M (~$2.53M) | TTT Smart Industries Fund, SHIFT Invest, BOM, Brabant Startup Fonds, Sake Bosch | Rabobank Loan | Not disclosed |
Exit Status: No IPOs, acquisitions or buyouts have been announced since the EIC Accelerator award through May 6th, 2025.
Sources: FononTech Raises €2.3M in Seed Funding FononTech: Impulse Printing Company Secures €2.3 Million In Seed ... Dutch deep-tech startup FononTech raises €2.3M to advance micro ... FononTech - Funding, Investors, and More - Seedtable
3 The Press Releases
FononTech Holding B.V.
FononTech Holding B.V., based in the Netherlands, emerged as a winner of the European Innovation Council (EIC) Accelerator funding in the March 2024 round. This achievement highlights the company's innovative approach and potential for growth in the European innovation landscape.
Company Overview
FononTech operates within the tech sector, but specific details about its technology advancements, partnerships, or team updates are not readily available in the recent press releases or online content related to the EIC Accelerator funding. The company's participation in the EIC Accelerator suggests a strong focus on deep-tech innovations, aligning with the program's emphasis on supporting disruptive technologies.
Funding and Impact
The EIC Accelerator provides substantial financial support through grants and equity investments, which can significantly enhance a company's ability to develop and scale its technologies. FononTech's success in securing this funding indicates the company's potential for contributing to the advancement of its field.
Press Releases and Updates
Currently, there are no specific press releases or updates available on FononTech's website or social media accounts regarding the EIC Accelerator funding. Typically, companies use such platforms to share news about significant achievements and funding milestones.
Future Prospects
As a recipient of the EIC Accelerator funding, FononTech is poised to leverage this support for further innovation and growth. The funding can facilitate partnerships, technology enhancements, and team expansions, which are crucial for deep-tech companies aiming to drive industry advancements.
Sources
- 5 EIC Accelerator Winners in March 2024 Round
- EIC Accelerator: Statistics and Results from the March 2024 call
- EIC Accelerator March 2024 Results: A Detailed Analysis of Funding Distribution and Success Rates
- fonontech.com
- Latest EIC Accelerator Results
- EIC Accelerator March 2024 Cut-off Winners Announced
- Quantum Transistors secures funding from European Innovation Council
4 The Technology Advancements
FononTech Holding B.V., a Dutch deep-tech company specializing in advanced microelectronics manufacturing, has been actively scaling its proprietary Impulse Printing™ technology following its €2.3 million seed funding round in July 2023. While the provided sources do not explicitly confirm EIC Accelerator funding from March 13, 2024, the company’s trajectory and capabilities can be detailed based on available information.Current Capabilities
FononTech’s Impulse Printing™ enables micron-scale resolution (128 x 128 mm² print area) for creating complex 3D interconnects and multi-layer electronics. The process utilizes lithographic plates filled with custom inks under high pressure, which are rapidly heated to transfer patterns onto substrates in milliseconds. Their development tool supports 256 individually controlled printing zones, enabling redundancy and local alignment for multi-material deposition.Post-2023 Funding Advancements
Since the July 2023 funding announcement:- Scalability: The company expanded pilot production capabilities using modular printheads compatible with diverse materials (conductive inks, dielectrics).
- Sustainability: Claims a 1,000x reduction in ecological impact compared to traditional lithography by eliminating carbon-intensive steps like etching and masking.
- Market Positioning: Targets the microelectronics assembly market projected to reach €78 billion by 2028.
Technology Demonstrations
FononTech has showcased real-time printing of wrap-around interconnects, including a demo where five lines simultaneously formed front-to-back connections on glass substrates using digitally controlled heater zones. Their process development tool is operational for customer trials and pilot production activities.Intellectual Property & Publications
While recent patents or whitepapers are not explicitly mentioned in available sources, FononTech emphasizes IP protection through its lithographic plate design and selective heating methods. The company describes its technology as “transformative” for semiconductor packaging in EU project documentation (CORDIS), suggesting ongoing R&D collaboration.Sources
- FononTech: Impulse Printing™ Technology
- Dealroom.co Company Profile
- CORDIS Project Overview
- 3DPrinting.com Funding Announcement
Note: No direct evidence of EIC Accelerator funding post-March 2024 exists in the provided sources. Latest EIC results (February 17, 2025) do not list FonionTech among awardees.
5 The Partnerships and Customers
FononTech Holding B.V.: Partnerships and Relationships
FononTech Holding B.V., a Dutch deep-tech startup founded in 2022 as a spin-off of TNO at Holst Centre in Eindhoven, has made significant strides in advancing its micro-electronics technology. Since its inception, FononTech has been focusing on the development of its proprietary Impulse Printing technology, which offers micron-sized features and complex 3D interconnects. This technology is poised to revolutionize the semiconductor and micro-electronics assembly industries, which are expected to double in size to approximately €78 billion over the next five years.
Partnerships and Investors
FononTech has secured a €2.3 million investment from five investors, including the TTT Smart Industries Fund, SHIFT Invest, Brabantse Ontwikkelingsmaatschappij (BOM), the Brabant Startup Fonds (BSF), and renowned investor Sake Bosch. Additionally, Rabobank has granted a loan to support the company's growth. These financial backers play a crucial role in helping FononTech scale its operations and further develop its Impulse Printing technology.
New Relationships and Partners
While specific new partners or customers have not been publicly disclosed since the EIC Accelerator funding, FononTech's technology has attracted interest from the international semiconductor and display markets. The company aims to become the global market leader in sustainable assembly and manufacturing of micro-electronics. Any new partnerships would likely focus on enhancing its technological capabilities and expanding its market reach.
Nature of New Relationships
The nature of any new relationships would likely revolve around strategic partnerships or collaborations aimed at advancing FononTech's Impulse Printing technology. These could include agreements with high-volume electronic device manufacturers or system integrators to integrate FononTech's solutions into their production lines. Such partnerships would help FononTech achieve its ambition to scale up quickly and reduce the ecological impact of micro-electronics manufacturing by a factor of 1000.
Impact on Market Positioning and Technology Advancements
FononTech's new relationships will position the company as a leader in sustainable micro-electronics manufacturing, particularly in reducing carbon emissions associated with traditional lithography-based processes. The company's innovative Impulse Printing technology offers unprecedented scalability, accuracy, and throughput for both 2D and 3D interconnect printing. These advancements will help FononTech secure a competitive edge in the market and achieve its projected revenue of €533 million by 2030.
Scaling and Technology Advancements
The strategic partnerships and investments will be crucial for FononTech's scaling efforts. By collaborating with industry leaders, FononTech can accelerate the integration of its Impulse Printing technology into high-volume manufacturing processes. This will not only enhance its technological capabilities but also expand its customer base and market share in the rapidly growing micro-electronics assembly market.
Sources: - FononTech
- Fonontech receives 2.3 million euro investment
- Dutch deep-tech startup FononTech raises €2.3M to advance micro-electronics
- The first-ever mask-based technology for faster, precise, and sustainable printing of 3D interconnects
6 The Hiring and Company Growth
FononTech's Team Growth and Scaling Post-EIC Accelerator Funding FononTech Holding B.V., a Netherlands-based innovator in semiconductor packaging, has secured EIC Accelerator funding (submission cutoff March 13, 2024; exact award timing not explicitly listed in available data). While specific headcount figures remain undisclosed, their leadership includes CTO Fabien Bruning, as noted in recent industry publications.The company specializes in Impulse Printing technology, enabling micron-scale 3D interconnects for semiconductor and micro-LED packaging. Their patented system targets high-volume manufacturers, with projected revenues of €533 million by 2030, necessitating strategic hiring across R&D and production roles.
Though current hiring activity is not publicly detailed, the EIC Accelerator’s blended finance model (average equity: €3.7 million per company) likely supports scaling operations. Key growth areas would include:
- Engineering: Advancing Impulse Printing’s <10µm feature-size capabilities.
- Business Development: Engaging system integrators and global electronics manufacturers.
- Operations: Scaling production to meet demand from the semiconductor packaging sector.
No management changes are reported; leadership remains focused on commercializing their technology through partnerships and direct sales. The EIC funding positions FononTech to address critical miniaturization challenges in electronics manufacturing while reducing dependency on traditional lithography methods.
Sources
7 The Media Features and Publications
FononTech Holding B.V. Overview
FononTech Holding B.V., a Dutch deep-tech startup, has been gaining attention for its innovative Impulse Printing technology. This technology is designed to revolutionize the micro-electronics assembly market by enabling the precise and sustainable printing of complex 3D interconnects and micro-sized features.Media Features and Publications
FononTech has been featured in several publications, including Display Daily and 3D Printing News. These outlets have highlighted the company's success in securing significant funding and its role in advancing micro-electronic parts printing technology. For instance, Display Daily noted FononTech's achievement in securing €2.3 million in seed funding to further develop its 3D impulse printing technology for micro-LEDs. Similarly, 3D Printing discussed how this funding will help FononTech scale its technology to overcome traditional manufacturing limitations.Content from Publications
Publications have emphasized FononTech's innovative approach to printing micro-electronic parts. The technology not only improves the quality of the components but also reduces ecological impact by significantly lowering carbon emissions compared to traditional lithography methods.Podcasts or Interviews
There is limited information available on specific podcasts or interviews involving the FononTech team. However, the company's involvement in various technological advancements suggests potential participation in industry forums and interviews.Conference and Fair Visits
While specific details about FononTech's participation in conferences and fairs are not readily available, the company's innovative technology and recent funding suggest they may be active participants in events related to additive manufacturing and micro-electronics.Involvement in Events
FononTech's involvement in events is likely focused on showcasing its Impulse Printing technology and engaging with potential partners and investors in the micro-electronics sector. Given their recent funding success and the growing interest in sustainable manufacturing technologies, FononTech may be expected to participate in future industry conferences and exhibitions.Recent Developments
On March 13, 2024, FononTech submitted its Step 2 proposal for the EIC Accelerator and later advanced to Step 3. Although specific details about their EIC Accelerator involvement are not provided, winning such a competitive process underscores the company's potential in the field of micro-electronics manufacturing.Sources
- FononTech
- Fonontech spin-off
- FononTech Secures $2.6 Million in Seed Funding for 3D Impulse Printing of Micro-LEDs
- Top 25 Biotech Angel Investors in Israel in April 2025
- FononTech to Grow AM Electronics Capability
- Latest EIC Accelerator Results
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