1 The EIC Accelerator Project

EIC Accelerator Program Overview

The European Innovation Council (EIC) Accelerator program is a flagship initiative designed to support small and medium-sized enterprises (SMEs) and startups in Europe, particularly those engaged in deep-tech innovation. The program offers a unique funding mechanism, combining both grants and equity investments, to help these companies scale up, commercialize their innovations, and penetrate global markets.

Funding Structure

The EIC Accelerator provides a blend of funding options that are pivotal for startups in their growth phases. The program allows for grants of up to €2.5 million, which serve as non-repayable funds aimed at covering the costs associated with innovation activities. This grant component is crucial for companies that need to validate their technology or develop prototypes without incurring significant debt.

In addition to the grant, the EIC Accelerator offers equity investments, which can amount to up to €15 million until 2024 and is set to decrease to €10 million from 2025 onward. This equity funding is designed to facilitate the scaling of innovative businesses by providing them with the necessary capital while also allowing them to leverage private sector investments. The blended finance approach not only reduces the financial burden on startups but also enhances their attractiveness to private investors by demonstrating institutional backing.

Purpose in the DeepTech and Startup Ecosystem

The EIC Accelerator aims to bridge the gap between innovative ideas and market implementation. It plays a critical role in the European deep-tech ecosystem by fostering technological advancements that can lead to sustainable growth. The program targets high-potential startups that are developing cutting-edge solutions in fields such as artificial intelligence, biotechnology, and advanced manufacturing. By providing adequate funding and support, the EIC Accelerator nurtures innovation, stimulates job creation, and enhances Europe's global competitiveness.

Role in Scaling Companies

The EIC Accelerator not only provides financial backing but also offers strategic guidance, networking opportunities, and access to a vast ecosystem of investors, mentors, and industry experts. This multifaceted support structure enables companies to scale efficiently and obtain the necessary funding from private sectors. The program encourages collaboration among startups, established enterprises, and research institutions, fostering an environment conducive to innovation and market entry.

Summary of EIC Accelerator Winner: FERROELECTRIC MEMORY GMBH

Project Acronym: Fe-NVRAM
Website: ferroelectric-memory.com
Country: Germany
Funding Type: Blended Finance
Submission Date: November 8, 2023

Project Overview:
FERROELECTRIC MEMORY GMBH has developed the Fe-NVRAM project, which aims to address the significant scaling challenges faced by the memory industry. The focus of this initiative is the creation of high-speed, low-complexity, and low-cost non-volatile ferroelectric memory (Fe-NVRAM) produced within the European Union.

Technology Basics and Background

Ferroelectric memory (Fe-NVRAM) is an emerging memory technology that leverages the unique properties of ferroelectric materials to store data. Unlike conventional non-volatile memory solutions, Fe-NVRAM offers several distinct advantages, including faster data access speeds, lower power consumption, and enhanced scalability.

The technology utilizes the ferroelectric effect, where certain materials exhibit a spontaneous electric polarization that can be reversed by the application of an external electric field. This characteristic allows for data storage at a molecular level, enabling faster read and write operations compared to traditional memory types such as Flash memory.

Fe-NVRAM is particularly beneficial for applications requiring high performance and reliability, such as in IoT devices, automotive systems, and data centers. The project aims to manufacture this advanced memory technology within the EU, thereby contributing to the region’s technological independence and fostering local economic growth.

By winning the EIC Accelerator funding, FERROELECTRIC MEMORY GMBH is positioned to leverage substantial financial resources to further develop their Fe-NVRAM technology, attract additional investments, and ultimately disrupt the memory market with their innovative solutions.

2 The Funding Rounds

# Ferroelectric Memory GmbH: Funding and Investment Analysis

Ferroelectric Memory GmbH (FMC), based in Dresden, Germany, is a leader in ferroelectric hafnium oxide technology, developing advanced non-volatile memory solutions for the semiconductor industry. The company has secured significant funding to advance its innovative memory technology that offers superior performance compared to other emerging memory solutions.

Funding Rounds and Financial History

Ferroelectric Memory has gone through several funding rounds since its founding in 2016:

Series B Funding - November 2020

FMC completed a significant $20 million Series B funding round in November 2020. This oversubscribed round was led by new investors M Ventures and imec.xpand, with participation from strategic investors including:

• SK hynix
• Robert Bosch Venture Capital
• TEL Venture Capital
• eCapital (lead investor from Series A who also participated in this round)

The funding was intended to accelerate the commercialization of FMC's ferroelectric field-effect transistor (FeFET) and capacitor (FeCAP) technology for applications in AI, IoT, embedded memory, and high-performance stand-alone data center sectors.

EIC Accelerator Grant - November 2023

Ferroelectric Memory received a €2.5 million grant from the European Innovation Council (EIC) Accelerator program in November 2023. This grant came after the company submitted its Step 2 proposal on November 8, 2023, and subsequently succeeded in the Step 3 interview.

Additional Funding

The company also raised €4.6 million in growth financing in September 2023, shortly before receiving the EIC Accelerator grant.

Total Funding

According to available data, Ferroelectric Memory's total funding amounts to approximately $27.9 million across all rounds, combining equity investments and grants.

Company Expansion Plans

Following the Series B funding round, Ferroelectric Memory announced plans to:

Technology and Market Position

FMC's memory technology leverages the ferroelectric properties of crystalline hafnium oxide (HfO2), which is already used as the gate insulator material in CMOS transistors. The company's patent-protected technology transforms standard CMOS transistors and capacitors into non-volatile memory cells.

Key advantages of FMC's technology include:

• High speed operation
• Ultra-low power consumption
• CMOS logic compatibility
• Reduced manufacturing costs
• Extreme temperature stability
• Complete magnetic immunity
• High radiation resistance

The company has been working closely with major semiconductor companies and foundries across the US, Europe, and Asia to integrate its technology into existing manufacturing processes without requiring additional capital expenditures.

Market Context

As of 2025, the private capital markets have been experiencing improvements in both valuations and round sizes across different funding series, which positions companies like Ferroelectric Memory favorably for potential future funding rounds or exit opportunities.

No information about company valuations, IPO plans, buyouts, or acquisition events related to Ferroelectric Memory GmbH was found in the search results.

Sources: - Ferroelectric Memory Company company information, funding

• Ferroelectric Memory Company company information, funding
• FeFET Memory Startup gets $20m to Turn Logic into Memory Cells
• Ferroelectric Memory GmbH (FMC) Raises $20 M to Accelerate Next
• Ferroelectric Memory Raises $20m in Series B funding
• Ferroelectric Memory completed a $20 million Series B funding led by M Ventures and imec.xpand

3 The Press Releases

FERROELECTRIC MEMORY GMBH: EIC Accelerator Funding and Technology Advancements FERROELECTRIC MEMORY GMBH (FMC), a Germany-based innovator in non-volatile memory solutions, secured EIC Accelerator funding under the November 8, 2023, cut-off round. The company’s winning proposal focused on Fe-NVRAM, a high-speed, low-cost ferroelectric memory technology designed to address scaling challenges in semiconductor industries.

Key Details

• Funding Type: Blended finance (grant + equity) under the EIC Accelerator’s €285 million budget allocation for 42 companies.
• Technology: Fe-NVRAM leverages ferroelectric materials to enable fast write cycles and energy efficiency, targeting AI memory applications and IoT devices. FMC aims to commercialize FeFET (ferroelectric field-effect transistor) technology at advanced nodes, including 7nm processes.
• Market Context: The global ferroelectric RAM market is projected to grow at a CAGR of over 5% through 2032, driven by demand for non-volatile solutions in automotive electronics (e.g., ADAS) and medical devices.

Partnerships and Roadmap

FMC has attracted backing from industry leaders like SK Hynix and Bosch, who supported its efforts to scale FeFET designs for embedded memory applications. While recent press releases specific to their website (ferroelectric-memory.com) are not indexed in available sources, the company participated in the October 2024 EIC ePitching event on quantum technologies, highlighting its role as an EIC-backed innovator.

Strategic Focus

• Key Applications: Embedded non-volatile memory for IoT sensors, storage-class memory for data centers, and neuromorphic computing architectures.
• IP Strategy: FMC operates as a fabless designer licensing process IPs—a model comparable to ARM Holdings—to accelerate adoption across semiconductor foundries.

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Sources

• Unveiling the Latest EIC Accelerator Results: A Comprehensive Analysis
• EIC ePitching on Quantum, Semiconductors and Photonics
• Ferroelectric Ram Market Size Report

4 The Technology Advancements

Ferroelectric Memory GmbH: Advancements and Developments

Ferroelectric Memory GmbH, based in Germany, has been at the forefront of developing innovative memory technologies. Since receiving the EIC Accelerator funding, the company has continued to advance its unique hybrid memory solutions.

Current Capabilities

Ferroelectric Memory GmbH specializes in integrating ferroelectric materials, particularly hafnium oxide (HfO₂), into semiconductor memories to create non-volatile DRAM+ technology. This technology combines the high performance of DRAM with the non-volatility and energy efficiency of ferroelectric memory, making it ideal for applications in AI, automotive, industrial, and medical sectors.

Advancements and Improvements

Since the funding, Ferroelectric Memory GmbH has partnered with Neumonda to further develop and commercialize its DRAM+ technology. This collaboration aims to revive semiconductor memory manufacturing in Germany by leveraging Neumonda's advanced test platforms and consulting services. The partnership is crucial for refining and validating Ferroelectric Memory GmbH's products, which are designed to provide DRAM performance with SSD-like storage capabilities.

Market Demonstration

There is no specific information on market demonstrations or pilots involving customers. However, the collaboration with Neumonda is expected to accelerate the development and market readiness of Ferroelectric Memory GmbH's technologies.

New Patents and Publications

While there is no specific mention of new patents or scientific studies published by Ferroelectric Memory GmbH since the funding, the company's focus remains on developing scalable, CMOS-compatible ferroelectric memory solutions. A related patent, though not directly attributed to Ferroelectric Memory GmbH, discusses advancements in ferroelectric structures without critical-thickness limitations, indicating ongoing innovation in the field.

Conclusion

Ferroelectric Memory GmbH has made significant strides in advancing its non-volatile DRAM+ technology. The partnership with Neumonda highlights its commitment to reviving European semiconductor manufacturing capabilities. Further developments and market demonstrations are anticipated as the company continues to innovate and scale its technologies.

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Sources: - Ferroelectric Memory Company

• Novel Memory “DRAM+” May Emerge as Germany Restarts Memory Chip Production
• German memory innovators aim to revive domestic memory chip manufacturing
• New 'DRAM+' Memory Designed to Provide DRAM Performance with SSD-like Storage Capabilities Uses FeRAM Tech
• FMC and Neumonda Team Up to Bring DRAM Manufacturing Back to Germany
• Ferroelectric Patents and Patent Applications
• Unveiling the Latest EIC Accelerator Results
• EIC Tech Report
• EIC Accelerator Winners and Statistics
• FRAM's Future Is Higher Densities

5 The Partnerships and Customers

Ferroelectric Memory GmbH: Partnerships and Advancements

Ferroelectric Memory GmbH (FMC), based in Dresden, Germany, is a leading innovator in ferroelectric memory technologies. The company has developed a disruptive technology using patented materials to create Ferroelectric Non-Volatile Random Access Memory (Fe-NVRAM), which offers speed comparable to DRAM but with non-volatility, reducing energy consumption by up to 90%.

Partnerships and Customers

FMC has secured significant partnerships and funding from prominent entities. In 2020, the company raised $20 million in a Series B funding round led by M Ventures and imec.xpand, with participation from SK Hynix, Robert Bosch Venture Capital, and TEL Venture Capital. These partnerships are crucial for advancing FMC's technology in the semiconductor value chain, supporting its expansion into international markets, and enhancing its ferroelectric field-effect transistor (FeFET) and capacitor (FeCAP) technologies.

New Partnerships and Customers

New Partnerships: The latest information does not specify new partnerships beyond the existing investors and partners. However, FMC's technology has garnered interest from clients and development partners in sectors like AI, IoT, and data centers, indicating potential future collaborations.

New Customers: Specific new customer names are not disclosed, but there is strong interest from customers seeking FMC's advantages in fast access, programming, and erase speeds, as well as its ultra-low energy budget.

Nature and Purpose of Relationships

The partnerships are strategic to enhance FMC's position in the market by leveraging the expertise and resources of its investors. The focus is on integrating FMC's technology into leading-edge CMOS logic processes, ensuring reduced manufacturing costs and compatibility with emerging technologies like AI and IoT.

Market Positioning

These relationships will position FMC as a key player in the ferroelectric memory market by advancing its technology and scaling its operations. FMC's Fe-NVRAM offers significant advantages over traditional volatile memory technologies, making it attractive for applications requiring fast, reliable, and energy-efficient data storage.

Technology Advancements and Scaling

The partnerships and funding will accelerate the commercialization of FMC's FeFET and FeCAP technologies. This will help in scaling up production and integrating these technologies into various sectors, including AI, IoT, and high-performance computing, where fast access times and low power consumption are critical. The support from major semiconductor companies like SK Hynix will also facilitate the integration of FMC's technology into broader semiconductor solutions, further enhancing its market presence.

Conclusion

Ferroelectric Memory GmbH is poised to significantly impact the memory technology landscape with its innovative ferroelectric solutions. Its strategic partnerships and funding will be instrumental in driving technological advancements and market expansion, especially in the rapidly growing fields of AI and IoT.

Sources: - Ferroelectric Memory Company raises $20m

• Ferroelectric Memory is a Verve Ventures portfolio company
• Ferroelectric Memory GmbH (FMC) Raises $20 M to Accelerate Next
• Ferroelectric Memory GmbH Raises $20M to Accelerate
• FeFET Memory Startup gets $20m to Turn Logic into Memory Cells

6 The Hiring and Company Growth

Ferroelectric Memory GmbH: Team Growth and Scaling Post-EIC Accelerator Funding While specific details about Ferroelectric Memory GmbH's (FMC) current headcount and hiring activities following its November 2023 EIC Accelerator win are not publicly disclosed, historical growth patterns and recent market developments suggest ongoing expansion.

• Team size: FMC had 11–50 employees as of earlier listings, with active recruitment efforts reported in past funding rounds (e.g., Analog/Mixed-Signal Designers, Characterization Engineers).
• Growth trajectory: The company secured €4.6 million in 2018 to expand its team and raised $20 million in Series B funding in 2020 to accelerate commercialization of FeFET/FeCAP technologies, indicating sustained scaling.
• Key positions: Technical roles critical for product development and market penetration have been prioritized historically. New hires would likely focus on R&D, embedded systems design, or partnerships for IoT/AI applications.
• Management changes: Ali Pourkeramati has served as Geschäftsführer (CEO) since 2019, with no recent leadership changes reported.

Post-EIC funding, FMC is poised to strengthen its hybrid memory technology—which offers non-volatility at low power—for microcontrollers in automotive, healthcare, and IoT sectors. Team growth would enhance its capacity to displace existing memory standards like flash/EEPROM through faster write cycles (1,000x speed improvements claimed).

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Sources

• Ferroelectric Memory Company - Startbase
• FMC Receives Growth Financing from eCAPITAL & HTGF
• 3D Ferroelectric Memory Devices Market Overview

7 The Media Features and Publications

Overview of Ferroelectric Memory GmbH

Ferroelectric Memory GmbH, based in Germany, is a notable recipient of the EIC Accelerator funding. The company submitted its proposal on November 8, 2023, and was later awarded funding in the Step 3 interview. Ferroelectric Memory GmbH has gained recognition for its innovative non-volatile memory solutions, particularly its ferroelectric hafnium oxide memory technology.

Media Features and Publications

Ferroelectric Memory GmbH has been featured in various publications and media outlets. It was highlighted in the context of EIC Accelerator winners, where it was noted for its high-speed, low-complexity, and low-cost non-volatile ferroelectric memory (Fe-NVRAM) technology. This technology is designed to address the scaling challenges in the memory industry and is suitable for AI and data center applications.

Podcasts and Interviews

There is no specific information available on podcasts or interviews featuring the team of Ferroelectric Memory GmbH. However, the company's innovative technology and participation in events like the IEEE IITC 2023 reflect its engagement with the industry.

Conference and Fair Visits

Ferroelectric Memory GmbH has participated in significant conferences, including the IEEE IITC 2023. At this event, Stefan Müller from Ferroelectric Memory GmbH presented a session on BEoL-integrated ferroelectric RAM for advanced semiconductor technology nodes. This participation underscores the company's commitment to advancing semiconductor technology through its innovative memory solutions.

Event Involvement

The company's involvement in events such as the EIC ePitching series further highlights its contribution to the field of quantum semiconductors and photonics. During these events, Ferroelectric Memory GmbH has showcased its non-volatile ferroelectric memory technology, emphasizing its high-speed performance and low cost for AI memory applications.

Funding and Partnerships

Ferroelectric Memory GmbH has received significant funding, including a $20 million Series B round led by M Ventures and imec.xpand, with participation from major semiconductor companies like SK hynix and Robert Bosch Venture Capital. This funding supports the commercialization of its ferroelectric field-effect transistor (FeFET) and capacitor (FeCAP) technology, which is integrated with leading-edge CMOS logic processes for reduced manufacturing costs.

Sources

• Unveiling the Latest EIC Accelerator Results: A Comprehensive Analysis
• EIC ePitching on Quantum, Semiconductors and Photonics
• 2023 IITC Program
• Ferroelectric Memory raises $20 million for embedded non-volatile memory tech