1 The EIC Accelerator Project

The EIC Accelerator program, part of the European Innovation Council (EIC), is designed to support innovative small and medium-sized enterprises (SMEs) and startups, particularly those in the deep tech sector. It aims to foster the development of breakthrough technologies and scalable business models that can address significant societal challenges. The program provides a unique blend of grant funding and equity investment, enabling companies to accelerate their growth and market entry.

Funding Structure

The EIC Accelerator offers blended finance, which combines non-dilutive grants and equity investments. The grant component can reach up to €2.5 million, providing essential financial support for early-stage projects. This funding is particularly advantageous for companies looking to develop innovative products or technologies without immediately giving away equity.

In parallel, the EIC Accelerator can also provide equity financing of up to €15 million until 2024. From 2025 onwards, this equity funding will be capped at €10 million. This investment is designed to support scaling operations, increasing market presence, and facilitating further research and development. The approach allows startups to leverage both types of funding to enhance their growth trajectory while minimizing initial dilution of ownership.

Purpose and Impact

The primary objective of the EIC Accelerator is to bridge the funding gap in the deep tech and startup ecosystem within Europe. Many innovative technologies face substantial challenges in securing adequate funding from private investors, especially during the early stages of development. The EIC Accelerator addresses these challenges by providing substantial financial backing and validation, helping companies to attract additional private sector investments.

By nurturing high-potential startups, the EIC Accelerator plays a pivotal role in promoting technological innovation, job creation, and economic growth across Europe. It supports companies in scaling their operations, reaching new markets, and ultimately contributing to the competitiveness of the European economy on a global scale.

Case Study: Lotus Microsystems ApS and Lotus MicroPower

Company Overview
Lotus Microsystems ApS, based in Denmark, is a pioneering company recognized for its innovative contributions to power conversion technologies. The company's project, known by the acronym Lotus MicroPower, aims to develop the world’s smallest power converters. This initiative received backing from the EIC Accelerator, highlighting the project's potential to disrupt the market.

Project Description
Lotus MicroPower focuses on creating ultra-compact power converters that are crucial for various electronic applications. These converters are designed to enhance efficiency and reduce the size of power management components, which is essential in today's miniaturized electronic devices. The project emphasizes innovation in the field of energy conversion, striving to address the growing demand for smaller, more efficient power solutions in sectors such as consumer electronics, automotive, and telecommunications.

Technology Fundamentals
The technology behind Lotus MicroPower involves cutting-edge engineering that integrates advanced semiconductor materials and innovative design principles. The converters utilize state-of-the-art circuit design techniques to minimize energy loss, thereby improving overall efficiency. Key technological features may include:

Market Relevance
The demand for smaller and more efficient power management solutions continues to rise, driven by trends such as the Internet of Things (IoT), wearable technology, and electric vehicles. By focusing on these needs, Lotus Microsystems places itself at the forefront of a rapidly evolving market, with the potential to capture significant market share and drive technological advancements.

In summary, the EIC Accelerator program serves as a crucial catalyst for innovation, providing essential funding and support to companies like Lotus Microsystems ApS. Through initiatives such as Lotus MicroPower, the program not only enhances the capabilities of individual companies but also strengthens the overall European tech ecosystem, fostering growth and competitiveness on a global scale.

2 The Funding Rounds

Lotus Microsystems ApS: Funding and Growth

Lotus Microsystems ApS, based in Denmark, is a fabless semiconductor company specializing in high-performance integrated power modules. The company's journey in securing significant funding began after winning the EIC Accelerator in October 2021.

Funding Rounds

Since winning the EIC Accelerator, Lotus Microsystems has successfully secured several rounds of funding:

• October 2021: The company received €2.3 million from the European Innovation Council as part of the EIC Accelerator grant funding.
• March 2023: Lotus Microsystems secured a grant, further solidifying its financial position with additional funding support.
• December 2023: The company received DKK 60 million (approximately €8 million) in early VC funding from Noon Ventures and the European Innovation Council. This significant investment marked a critical step in the company's growth phase, enabling collaborations with international electronics OEMs and advancing research and development initiatives.

Investor Information

The primary investors in Lotus Microsystems include:

• Noon Ventures: A deep-tech venture firm that led the early VC round in December 2023.
• European Innovation Council (EIC): Provided both grant funding in October 2021 and support in the December 2023 funding round.
• Undisclosed Investors: Participated in the Seed funding round of $8.85 million on December 14, 2023.

Funding Timing and Amount

• Date: October 2021
• Amount: €2.3 million
• Type: Grant funding from the European Innovation Council
• Date: March 2023
• Amount: Not specified
• Type: Grant funding
• Date: December 2023
• Amount: DKK 60 million
• Type: Early VC funding
• Date: December 14, 2023
• Amount: $8.85 million
• Type: Seed funding

Company Valuations

As of December 2023, Lotus Microsystems' enterprise valuation was estimated to be between $35 million and $53 million, according to Dealroom.

Exit Events

There are no reported exit events such as IPOs, buyouts, or acquisitions for Lotus Microsystems as of now. The company continues to focus on growth and technological advancements in the semiconductor industry.

Additional Information

Lotus Microsystems' technology focuses on silicon-based integration for power management, offering superior thermal performance and power density. The company is well-positioned to meet industry demands for high-performance computing and portable electronics.

Sources: - Lotus Microsystems company information, funding & investors

• Lotus Microsystems Stock Price, Funding, Valuation, Revenue...
• Lotus Microsystems company information, funding & investors
• Lotus Microsystems
• Lotus Microsystems Secures DKK 60 Million Funding and Appoints...

3 The Press Releases

Overview of Lotus Microsystems ApS

Lotus Microsystems ApS, a Danish company specializing in high-performance integrated power modules, has been a recipient of the EIC Accelerator funding. Since winning the funding in October 2021, the company has made significant advancements in technology, partnerships, and team updates.

Technology Advancements

Lotus Microsystems has developed innovative power solutions using its proprietary Power Interposer Technology. This technology enables the integration of active and passive components into a single package, offering superior thermal performance and power density compared to traditional power module packaging. The company's focus on miniaturization and thermal efficiency supports applications in AI, Edge computing, and IoT devices.

Recent Press Releases and Updates

• Exhibition at PCIM Europe 2025: Lotus Microsystems will be showcasing its advanced power solutions at PCIM Europe 2025, highlighting products like the LMU20P1 high-efficiency boost converter and the Lotus thermal guide (LTG) evaluation board. These solutions aim to meet the industry's increasing demands for miniaturization and thermal efficiency.
• Appointment of Stefan Stockbauer: In February 2025, Stefan Stockbauer joined the company as Director of Sales and Marketing, bringing extensive experience to enhance Lotus Microsystems' market presence.
• Funding and Leadership: In December 2023, Lotus Microsystems secured DKK 60 million in funding and appointed Hans Hasselby-Andersen as CEO. This investment supports collaborations with international electronics OEMs and accelerates R&D initiatives.

Partnerships and Funding

The company has received significant funding from Noon Ventures and the European Innovation Council, which has enabled it to partner with leading global semiconductor facilities. This strategic positioning supports Lotus Microsystems in its ambition to contribute to the European semiconductor industry's growth.

Patents and Intellectual Property

While specific details about patents are not mentioned in recent updates, the company's technology is built on extensive research and development in nanofabrication and power electronics, indicating a strong focus on intellectual property protection.

Sources

• Lotus Microsystems
• Lotus Microsystems to Exhibit at PCIM Europe 2025
• Lotus Microsystems at PCIM Europe 2025
• New Sales Director at Lotus Microsystems
• Lotus Microsystems Secures DKK 60 Million Funding
• Lotus Microsystems – Høiberg

4 The Technology Advancements

Overview of Lotus Microsystems ApS

Lotus Microsystems ApS is a Danish fabless semiconductor company specializing in high-performance integrated power modules. Founded in 2020 by Ph.D. graduates from the Technical University of Denmark (DTU), the company focuses on advancing power density and thermal performance in electronic devices. Their technology includes the use of silicon interposers in power applications, enabling better thermal management and increased power density compared to traditional packaging methods.

Advancements and Funding

Since receiving the EIC Accelerator funding in October 2021, Lotus Microsystems has continued to grow and innovate. Most recently, in December 2023, the company secured an additional funding of 60 million DKK from Noon Ventures and the European Innovation Council. This investment supports the company's expansion into new markets and enhances its research and development capabilities, particularly in collaborations with international electronics OEMs.

Technological Improvements

Lotus Microsystems' technology features a proprietary power interposer that significantly improves thermal performance, often by up to 60% compared to conventional power module packaging. This innovation supports higher power density and reduces thermal hotspots, making it suitable for applications ranging from high-performance computing to mobile devices. The company has also been developing multiple products, with plans to release them to the market. By early 2023, Lotus Microsystems was close to launching two products, with a third in the pipeline.

Market Demonstration and IP Position

The company aims to ship 50-100 million power modules before 2027. While there are no specific details on large-scale market demonstrations or customer trials, Lotus Microsystems has emphasized the importance of a strong intellectual property (IP) position to compete effectively in the semiconductor industry. They work closely with HØIBERG to ensure their products do not infringe existing patents and to protect their innovations through patents and trade secrets.

New Patents and Publications

Recent publications include a paper in the IEEE Transactions on Power Electronics in 2023, highlighting advancements in power electronics by the company's researchers. Additionally, Lotus Microsystems has filed intellectual property applications related to their innovative power management technologies.

Conclusion

Since receiving the EIC Accelerator funding, Lotus Microsystems has made significant strides in technology development and market preparation. The company's focus on improving power density and thermal performance positions it as a key player in the semiconductor industry, particularly in Europe.

Sources

• Lotus Microsystems
• Lotus Microsystems Secures DKK 60 Million Funding and Appoints Hans Hasselby-Andersen as CEO
• Lotus Microsystems – Høiberg
• The World's Smallest Power Converters | Lotus MicroPower

5 The Partnerships and Customers

Lotus Microsystems ApS: Strategic Partnerships and Market Positioning Post-EIC Accelerator Funding

Since securing European Innovation Council (EIC) Accelerator funding in October 2021, Copenhagen-based Lotus Microsystems has advanced its proprietary Power Interposer Technology (PIT) and expanded commercial engagements. The company specializes in high-density power modules for AI hardware, GPUs, 5G/6G infrastructure, and edge devices.

Key Developments

• DKK 60 Million Funding Round (2023): Backed by Noon Ventures and the EIC, this investment accelerated R&D for miniaturized power converters like the LBK0504 step-down converter and thermal optimization solutions targeting AI chips and telecom hardware.
• Leadership Appointment: Hans Hasselby-Andersen joined as CEO to drive global commercialization, emphasizing partnerships with electronics OEMs seeking higher power density and thermal efficiency.
• Technology Advancements: PIT enables 3D integration of passive components (e.g., microinductors) with active devices using through-silicon vias (TSVs), achieving up to 83% efficiency at 22 MHz switching frequencies. Compared to PCB-based alternatives, PIT reduces thermal resistance by ~60%, enabling closer placement of power modules to high-current loads like AI processors.

Partnerships & Commercial Strategy

While specific customer names remain undisclosed, Lotus targets collaborations with:

• AI hardware manufacturers requiring compact voltage regulators for GPUs/ASICs.
• Telecom providers developing mmWave macro cells and optical transceivers demanding noise-resistant Power-System-in-Package (PSiP) solutions.
• The EIC funding facilitates scaling production capacity for these markets while enhancing competitiveness against laminate-substrate-based modules.

Market Positioning

Lotus’s technology addresses critical bottlenecks in power delivery networks for next-gen computing, where currents exceed 1,000 A per package. By eliminating hot spots through superior thermal redistribution, the company positions itself as a key enabler of energy-efficient AI-at-the-edge deployments and compact 5G infrastructure.

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Sources

• Lotus Microsystems Official Website
• Lotus Secures DKK 60 Million Funding
• Silicon Power Interposer Technology Paper

6 The Hiring and Company Growth

Lotus Microsystems, a fabless semiconductor company based in Copenhagen, Denmark, received EIC Accelerator funding in October 2021. Since then, the company has embarked on significant growth and strategic development.

Current Headcount and Team Size

As of now, specific details about the current headcount or team size of Lotus Microsystems are not publicly available. However, the company has expanded its Board of Directors with international industry leaders, which indicates significant strategic growth and investment in talent acquisition.

Hiring and Growth

Lotus Microsystems is actively developing and scaling its operations, particularly with the addition of new board members from prominent companies like Intel and Renesas. This strategic move positions the company for further growth in the competitive semiconductor industry. The company plans to ship 50-100 million power modules before 2027, indicating a substantial increase in production capacity and market reach.

Key Positions and Recent Hires

In March 2023, Lotus Microsystems welcomed two new members to its Board of Directors: Ashraf Lotfi and Arend van der Weijden. These additions bring significant experience from leading semiconductor companies, enhancing Lotus Microsystems' competitive edge and market potential. The company's focus on technology-driven innovation suggests that key positions might include roles related to power electronics, nanofabrication, and integrated circuit design.

Impact on Future Growth

The inclusion of experienced leaders in the board supports Lotus Microsystems' ambition to bring its innovative power conversion technology to market. This technology, featuring a silicon interposer, offers superior power density and thermal performance, crucial for applications in AI, 5G, and compact electronics. By leveraging their expertise, Lotus Microsystems aims to strengthen its position in the European semiconductor industry and expand its global footprint.

Major Changes in Management or Founding Team

There are no reported changes in the founding team. However, the expansion of the Board of Directors with international leaders underscores the company's strategic shift towards market-driven growth, complementing its technology-driven origins.

Scaling and Growth Opportunities

Lotus Microsystems' growth strategy is centered around its novel power converter technology, which addresses the increasing demand for high-power density and efficient thermal management in computing and electronic devices. By partnering with global semiconductor facilities and receiving significant financial backing, the company is well-positioned to achieve substantial market penetration and scalability.

Sources

• Lotus Microsystems Expands Board of Directors
• Lotus Microsystems Company Information
• Lotus Microsystems – Høiberg
• Lotus Microsystems

7 The Media Features and Publications

Lotus Microsystems ApS: A Leader in Power Management Solutions

Overview

Lotus Microsystems ApS is a Danish fabless manufacturer specializing in high-performance integrated power modules. Founded in 2020 by Ph.D. graduates from the Technical University of Denmark (DTU), the company focuses on innovative power management solutions using proprietary silicon interposer technology. This technology enhances power density and thermal performance, which are crucial for compact electronic devices and next-generation computing applications like AI and Edge computing.

Media Features and Publications

Lotus Microsystems has been featured in various publications and events, particularly for its advancements in power electronics. The company is set to showcase its advanced power solutions at PCIM Europe 2025, highlighting products like the LMU20P1 high-efficiency boost converter and the Lotus Power Interposer technology. These solutions are designed to meet the growing demands for miniaturization, thermal efficiency, and system integration in electronics.

Podcasts and Interviews

One notable interview involves the CEO of Lotus Microsystems, who was featured in an ipXchange interview discussing innovations in power electronics. This highlights the company's role in advancing power management technology.

Conference and Fair Participations

Lotus Microsystems is actively involved in international conferences. Notably, the company will participate in PCIM Europe 2025, where it will exhibit its cutting-edge power solutions, including the LMU20P1 evaluation board and the Lotus Thermal Guide (LTG) evaluation board. These products demonstrate the company's commitment to delivering compact, efficient systems.

Event Involvement

The company's participation in PCIM Europe 2025 is a key event where it will showcase its innovative power solutions. This event provides a platform for Lotus Microsystems to engage with industry professionals and demonstrate its technology.

EIC Accelerator Funding

Lotus Microsystems received EIC Accelerator funding in October 2021, which has supported its growth and innovation efforts. The funding has enabled the company to further develop its silicon interposer technology and expand its product offerings in the high-performance power management market.

Other Involvements

Dr. Ashraf Lotfi, a prominent figure in the power industry, serves on the board of Lotus Microsystems. His expertise in power management has likely contributed to the company's strategic direction and technological advancements.

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Sources:

• Lotus Microsystems
• Lotus Microsystems at PCIM Europe 2025 - Electronic Specifier
• Lotus Microsystems ApS - EOT-expo.com
• All Products - Lotus Microsystems
• Lotus Microsystems news from Electronic Specifier
• News - Lotus Microsystems
• CVD Equipment Corporation Announces Appointment of Dr. Ashraf Lotfi to Its Board of Directors